This inventor holds 2 USPTO granted patents and 4 published patent applications. Top assignee: Taiwan Semiconductor Manufacturing Comp. Ltd.. Active years: 2026.
Company Filing History:
Years Active: 2026
Title: Yu-Jin Hu: Innovator in Semiconductor Packaging Technology
Introduction
Yu-Jin Hu is a prominent inventor based in Taoyuan, Taiwan. She has made significant contributions to the field of semiconductor packaging technology. With a total of 2 patents to her name, her work focuses on innovative methods for enhancing the performance and reliability of integrated circuit chips.
Latest Patents
Yu-Jin Hu's latest patents include a package structure and a method of forming the same. This method involves forming an interconnect structure on a substrate, performing a laser grooving process to create openings, and applying a protective layer to ensure the integrity of the interconnect structure. Another notable patent is related to edge profile control of integrated circuit chips. This patent outlines a method for fabricating an integrated circuit chip package, which includes forming conductive pads and vias, as well as dicing the substrate to separate individual dies.
Career Highlights
Yu-Jin Hu is currently employed at Taiwan Semiconductor Manufacturing Company Limited. Her role at this leading semiconductor manufacturer allows her to apply her innovative ideas and contribute to advancements in the industry. Her expertise in semiconductor packaging has positioned her as a key player in the field.
Conclusion
Yu-Jin Hu's contributions to semiconductor technology through her patents demonstrate her commitment to innovation. Her work not only enhances the functionality of integrated circuits but also paves the way for future advancements in the industry.