Yu-Hsiao Li

Title: Innovations by Yu-Hsiao Li in Camera Module Assembly

Introduction

Yu-Hsiao Li is a notable inventor based in Taipei, Taiwan. He has made significant contributions to the field of camera module assembly, showcasing his expertise through innovative methods that enhance product quality.

Latest Patents

One of Yu-Hsiao Li's key patents is titled "Method for Assembling Camera Module." This invention discloses a method that involves placing multiple conductive bumps on a conductive contact of a substrate. The process creates a large conductive bump, which is essential for ensuring a reliable connection between the substrate and an image chip. By pressing the substrate and the image chip together, the conductive contact connects with a pad on the image chip through the large conductive bump. This innovative approach minimizes the risk of fracture between the substrate and the image chip, ultimately improving the quality of the camera module. Yu-Hsiao Li holds 1 patent for this invention.

Career Highlights

Yu-Hsiao Li is currently employed at Primax Electronics Ltd., where he continues to develop and refine technologies related to camera modules. His work has been instrumental in advancing the capabilities of camera systems used in various applications.

Collaborations

Yu-Hsiao Li collaborates with talented individuals such as Chien-Nan Yu and Chung-Feng Tsao, contributing to a dynamic team focused on innovation in electronics.

Conclusion

Yu-Hsiao Li's contributions to the field of camera module assembly demonstrate his commitment to innovation and quality. His patented methods are paving the way for advancements in camera technology, ensuring better performance and reliability in the products that utilize these systems.