The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 20, 2013
Filed:
Nov. 22, 2010
Chien-nan Yu, Taipei, TW;
Chung-feng Tsao, Taipei, TW;
Hang-kau Khor, Taipei, TW;
Wen-chi Shih, Taipei, TW;
Ying-chieh Chen, Taipei, TW;
Yu-hsiao LI, Taipei, TW;
Chien-Nan Yu, Taipei, TW;
Chung-Feng Tsao, Taipei, TW;
Hang-Kau Khor, Taipei, TW;
Wen-Chi Shih, Taipei, TW;
Ying-Chieh Chen, Taipei, TW;
Yu-Hsiao Li, Taipei, TW;
Primax Electronics, Ltd., Taipei, TW;
Abstract
The present invention discloses a method for assembling a camera module. The method includes putting plural conductive bumps on a conductive contact of a substrate such that a large conductive bump is formed, and pressing the substrate and an image chip together such that the conductive contact contacts with a pad formed on the image chip through the large conductive bump to combine the conductive contact and the pad. Since there is no contact between the substrate and the image chip but the large conductive bump, the method decreases the probability for fracture between the substrate and the image chip and improves the quality of the camera module.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile