This inventor holds 1 USPTO granted patent. Top assignee: Xintec Corporation. Active years: 2017.
Company Filing History:
Years Active: 2017
Title: Innovations of Yu-Hao Su in Chip Packaging Technology.
Introduction
Yu-Hao Su is a notable inventor based in Taipei, Taiwan. He has made significant contributions to the field of chip packaging technology. His innovative approach has led to the development of a unique chip package that enhances the efficiency and functionality of electronic devices.
Latest Patents
Yu-Hao Su holds a patent for a chip package and manufacturing method thereof. This patent describes a chip package that includes a chip, an isolation layer, and a redistribution layer. The chip features a substrate, an electrical pad, and a protection layer. The substrate has a first surface and a second surface, with a through hole present. The protection layer contains a concave hole, allowing the electrical pad to be exposed through both the concave hole and the through hole. The isolation layer is strategically positioned on the second surface, the sidewall of the through hole, and the sidewall of the concave hole. The redistribution layer consists of a connection portion and a passive element portion. The connection portion is situated on the isolation layer and is in electrical contact with the electrical pad. The passive element portion is also located on the isolation layer on the second surface, with an end connected to the connection portion.
Career Highlights
Yu-Hao Su is currently employed at Xintec Corporation, where he continues to innovate in the field of semiconductor technology. His work has been instrumental in advancing chip packaging methods, which are crucial for modern electronic devices.
Collaborations
Yu-Hao Su collaborates with talented individuals such as Yen-Shih Ho and Shu-Ming Chang. Their combined expertise contributes to the success of their projects and the advancement of technology in their field.
Conclusion
Yu-Hao Su's contributions to chip packaging technology exemplify the importance of innovation in the electronics industry. His patent and ongoing work at Xintec Corporation highlight his role as a key inventor in this rapidly evolving field.