Yu-Hao Kuo

Title: Yu-Hao Kuo: Innovator in Integrated Circuit Packages

Introduction

Yu-Hao Kuo is an inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of semiconductor technology, particularly in the area of integrated circuit packages. Although he currently holds no granted patents, his innovative ideas are reflected in his patent applications.

Latest Patent Applications

One of Yu-Hao Kuo's notable patent applications is titled "INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME." This application describes a method that includes bonding a first semiconductor die and a second semiconductor die to a substrate. A gap is disposed between a first sidewall of the first semiconductor die and a second sidewall of the second semiconductor die. The method involves performing a plasma treatment to dope the top surfaces and sidewalls of each semiconductor die with a first dopant. The concentration of the first dopant in the first sidewall decreases in a vertical direction from the top surface of the first semiconductor die towards its bottom surface. Similarly, the concentration of the first dopant in the second sidewall decreases in a vertical direction from the top surface of the second semiconductor die towards its bottom surface. Finally, the gap is filled with a spin-on dielectric material.

Conclusion

Yu-Hao Kuo's work in integrated circuit packages showcases his innovative approach to semiconductor technology. His contributions, although not yet reflected in granted patents, highlight the potential for future advancements in this field.