This inventor holds 2 USPTO granted patents and 1 EPO patent. Top assignees: Asm Technology Singapore Pte Ltd, Asmpt Singapore Pte. Ltd.. Active years: 2021-2023.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2021-2023
Title: Yu Fu Cheung: Innovator in Bonding Technology
Introduction
Yu Fu Cheung is a notable inventor based in Hong Kong, CN. He has made significant contributions to the field of bonding technology, holding a total of 2 patents. His innovative designs focus on enhancing the precision and efficiency of bonding processes in various applications.
Latest Patents
Cheung's latest patents include a high precision bonding apparatus comprising a heater. This bonding apparatus features a bond head structure, an optical unit, and an actuator unit. The bond head structure is designed to hold an electrical component that needs to be bonded to a base member. The optical unit allows for inspection of the electrical component through a look-through passage, ensuring accurate alignment during the bonding process.
Another significant patent is a bonding apparatus that incorporates variable force distribution. This apparatus includes a holding element, holding element actuators, sensors, a controller, and bond force adjusting actuators. The system measures reaction forces exerted on the holding element and adjusts the bond forces accordingly, allowing for precise control over the tilt of the electrical component relative to the base member.
Career Highlights
Throughout his career, Yu Fu Cheung has worked with reputable companies such as Asmpt Singapore Pte. Ltd. and Asm Technology Singapore Pte Ltd. His experience in these organizations has contributed to his expertise in bonding technologies and innovations.
Collaborations
Cheung has collaborated with several professionals in his field, including Wai Kin Cheung and Ming Yeung Luke Wan. These collaborations have likely fostered a creative environment that encourages innovation and the development of advanced bonding solutions.
Conclusion
Yu Fu Cheung is a distinguished inventor whose work in bonding technology has led to significant advancements in the industry. His patents reflect a commitment to precision and efficiency, making him a valuable contributor to the field.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile