Company Filing History:
Years Active: 2014
Title: Innovations by Yu-Chou Tseng in Semiconductor Technology
Introduction
Yu-Chou Tseng is a notable inventor based in Chiayi, Taiwan. He has made significant contributions to the field of semiconductor technology, particularly in the design and development of semiconductor packages. His innovative work focuses on enhancing thermal dissipation and electromagnetic interference (EMI) shielding in semiconductor devices.
Latest Patents
Yu-Chou Tseng holds a patent for "Semiconductor packages with thermal dissipation structures and EMI shielding." This patent describes a semiconductor package that includes a substrate, a semiconductor chip, a package body, a recess, and a conductive layer. The substrate features a grounding element, while the semiconductor chip is mounted on the substrate, encapsulated by the package body. The design includes a recess that exposes the upper surface of the semiconductor chip, and the conductive layer provides both thermal dissipation and EMI shielding, ensuring optimal performance of the semiconductor chip.
Career Highlights
Yu-Chou Tseng is currently employed at Advanced Semiconductor Engineering, Inc., where he continues to innovate in semiconductor packaging technologies. His work has been instrumental in advancing the efficiency and reliability of semiconductor devices.
Collaborations
Yu-Chou Tseng collaborates with talented colleagues, including I-Chia Lin and Jin-Feng Yang, who contribute to the innovative environment at Advanced Semiconductor Engineering, Inc.
Conclusion
Yu-Chou Tseng's contributions to semiconductor technology exemplify the importance of innovation in enhancing device performance. His patent on semiconductor packages showcases his commitment to advancing the field and improving the functionality of electronic devices.