Location History:
- Oakville, CA (2015)
- Hamilton, CA (2020)
- Westmont, IL (US) (2016 - 2022)
Company Filing History:
Years Active: 2015-2022
Title: Yu-Chih Tseng: Innovator in Nanoscale Domain Engineering
Introduction
Yu-Chih Tseng is a prominent inventor based in Westmont, IL (US). He has made significant contributions to the field of nanotechnology, holding a total of 7 patents. His work focuses on the development of innovative methods for creating nanoscale features that have applications in various industries.
Latest Patents
One of Yu-Chih Tseng's latest patents is titled "Ordered nanoscale domains by infiltration of block copolymers." This patent describes a method for preparing tunable inorganic patterned nanofeatures by using a block copolymer scaffold. The method involves sequential infiltration synthesis (SIS), which is related to atomic layer deposition (ALD). It includes selecting a metal precursor that selectively reacts with the copolymer unit defining the microdomain while being substantially non-reactive with another polymer unit of the copolymer. This process allows for the formation of tunable inorganic features on the microdomain, resulting in a hybrid organic/inorganic composite material. The organic component can be optionally removed to obtain inorganic features with patterned nanostructures defined by the configuration of the microdomain.
Career Highlights
Yu-Chih Tseng is currently associated with Uchicago Argonne, LLC, where he continues to push the boundaries of nanotechnology. His innovative approaches have garnered attention in the scientific community, contributing to advancements in material science and engineering.
Collaborations
He has collaborated with notable colleagues, including Seth B Darling and Jeffrey W Elam, who share his passion for research and innovation in the field of nanotechnology.
Conclusion
Yu-Chih Tseng's work exemplifies the spirit of innovation in the realm of nanoscale engineering. His contributions are paving the way for future advancements in technology and materials science.