This inventor holds 1 USPTO granted patent. Top assignee: Hong Kong Applied Science and Technology Research Institute. Active years: 2009.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2009
Title: Innovations of Yu-Chih Chen in Multi-Chip Packaging
Introduction
Yu-Chih Chen is a notable inventor based in Hong Kong, CN. He has made significant contributions to the field of electronics, particularly in the area of multi-chip packaging. His innovative work has led to the development of a patented technology that enhances the performance and reliability of electronic components.
Latest Patents
One of Yu-Chih Chen's key patents is titled "Stacked Multi-Chip Package with EMI Shielding." This invention features a stacked multi-chip package that incorporates an EMI shielded component. The design includes first and second substrates that are mounted together by a grid array of metallic connecting nodes, such as a solder Ball Grid Array. Each substrate has a conductive plane associated with it. An electronic component is mounted between the first and second substrates and is surrounded by a group of metallic connecting nodes that are electrically connected to the conductive planes of both substrates, forming a conductive Faraday cage around the component. This innovative design helps to mitigate electromagnetic interference, thereby improving the overall performance of electronic devices.
Career Highlights
Yu-Chih Chen is affiliated with the Hong Kong Applied Science and Technology Research Institute, where he continues to work on advancing technology in the field of electronics. His expertise and innovative mindset have positioned him as a valuable asset in his organization.
Collaborations
Yu-Chih Chen collaborates with talented colleagues, including Lap Wai Leung and Man-Lung Sham. Their combined efforts contribute to the advancement of research and development in their field.
Conclusion
In summary, Yu-Chih Chen's contributions to multi-chip packaging technology demonstrate his innovative spirit and commitment to enhancing electronic component performance. His patented work not only showcases his expertise but also reflects the collaborative nature of technological advancements in Hong Kong.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile