The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 07, 2009
Filed:
Sep. 15, 2006
Lap Wai Leung, Hong Kong, HK;
Yu-chih Chen, Hong Kong, HK;
Man-lung Sham, Hong Kong, HK;
Chang-hwa Chung, Hong Kong, HK;
Lap Wai Leung, Hong Kong, HK;
Yu-Chih Chen, Hong Kong, HK;
Man-Lung Sham, Hong Kong, HK;
Chang-Hwa Chung, Hong Kong, HK;
Hong Kong Applied Science Technology Research Institute Company Limited, Shatin, New Territories, HK;
Abstract
A stacked multi-chip package with an EMI shielded component has first and second substrates mounted together by a grid array of metallic connecting nodes, such as a solder Ball Grid Array. Each substrate has a conductive plane associated with it. An electronic component is mounted between the first and second substrates and is surrounded by a group of the metallic connecting nodes that are also electrically connected to the conductive planes of both substrates to form a conductive Faraday cage about the component.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile