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For the Inventor, By the Inventor

Taichung, Taiwan

Yu-Chieh Tsai

This inventor holds 3 USPTO granted patents. Top assignee: Siliconware Precision Industries Co., Ltd.. Active years: 2008-2011.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Yu-Chieh Tsai. Retrieved from https://idiyas.com/inventor/yu-chieh-tsai

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 3

Average Co-Inventor Count = 4.0

ph-index = 1

Forward Citations = 71(Granted Patents)


Company Filing History:

goldMedal3 out of 826 
 
Siliconware Precision Industries Co., Ltd.
 patents

Years Active: 2008-2011

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3 patents (USPTO):Explore Patents
1. 7985618 - Semiconductor device has encapsulant with chamfer such that portion of substrate and chamfer are exposed from encapsulant and remaining portion of surface of substrate is covered by encapsulant (2011-07-26),
2. 7884456 - Semiconductor device has encapsulant with chamfer such that portion of substrate and chamfer are exposed from encapsulant and remaining portion of surface of substrate is covered by encapsulant (2011-02-08),
3. 7443016 - Semiconductor device for use as multimedia memory card, has encapsulant with chamfer such that portion of substrate and chamfer are exposed from encapsulant and remaining portion of surface of substrate is covered by encapsulant (2008-10-28),

Title: Innovations of Yu-Chieh Tsai in Semiconductor Technology

Introduction

Yu-Chieh Tsai is a prominent inventor based in Taichung, Taiwan. He has made significant contributions to the field of semiconductor technology, holding three patents that showcase his innovative approach to device fabrication. His work focuses on enhancing the efficiency and functionality of semiconductor devices.

Latest Patents

Yu-Chieh Tsai's latest patents include a semiconductor device that features an encapsulant with a chamfer. This design allows for a portion of the substrate and the chamfer to be exposed from the encapsulant, while the remaining surface of the substrate is covered. The invention involves forming an opening with at least one slanted side on a substrate, where at least one chip and one passive component are mounted. An encapsulant with a cutaway corner is then formed to encapsulate these components. The cutaway corner is strategically spaced from the slanted side of the opening, allowing for a precise singulation process that results in a package with a chamfer. This innovative design not only improves the semiconductor device's performance but also introduces a new carrier for the device.

Career Highlights

Yu-Chieh Tsai is associated with Siliconware Precision Industries Co., Ltd., a leading company in the semiconductor industry. His work has been instrumental in advancing the company's technological capabilities and product offerings. His patents reflect a deep understanding of semiconductor fabrication processes and a commitment to innovation.

Collaborations

Some of Yu-Chieh Tsai's notable coworkers include Yun-Lung Tsai and Chien-Chih Chen. Their collaborative efforts contribute to the ongoing advancements in semiconductor technology at their company.

Conclusion

Yu-Chieh Tsai's contributions to semiconductor technology through his innovative patents highlight his role as a key inventor in the field. His work continues to influence the development of more efficient and effective semiconductor devices.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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