This inventor holds 3 USPTO granted patents. Top assignee: Siliconware Precision Industries Co., Ltd.. Active years: 2013-2015.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2013-2015
Title: Yu Cheng Pai: Semiconductor Packaging Inventor
Introduction
Yu Cheng Pai is an inventor based in Taichung, Taiwan. His patent work focuses on semiconductor packaging methods designed to support thin substrates during manufacturing.
Latest Patents
Pai’s listed portfolio includes 3 patents. Two of his latest patent titles are “Fabrication Method of Semiconductor Package” and “Semiconductor Package and Fabrication Method Thereof.”
Both describe a process that uses first and second carriers to support a packaging substrate through fabrication. After the first carrier is removed, a chip is placed on the substrate and covered with encapsulant; the second carrier is then removed. The carrier-supported process is intended to reduce cracking and warpage, accommodate thinner packages, and improve manufacturing yield.
Career Highlights
Pai is associated with Siliconware Precision Industries Co., Ltd., a company involved in semiconductor packaging. His listed inventions address manufacturing challenges related to thin packaging substrates and package miniaturization.
Collaborations
Chun Hsien Lin and Ming Chen Sun are identified as Pai’s coworkers.
Conclusion
Yu Cheng Pai’s patent work centers on carrier-supported semiconductor packaging processes that help protect thin substrates during fabrication and advance miniaturized package production.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile