Yamanashi, Japan

Yousuke Hassaku

USPTO Granted Patents = 2 

 

Average Co-Inventor Count = 5.0

ph-index = 1


Company Filing History:


Years Active: 2013-2016

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2 patents (USPTO):Explore Patents

Title: Yousuke Hassaku: Innovator in Electronic Component Technology

Introduction

Yousuke Hassaku is a notable inventor based in Yamanashi, Japan. He has made significant contributions to the field of electronic components, holding a total of 2 patents. His work focuses on improving the efficiency and accuracy of electronic component mounting processes.

Latest Patents

Hassaku's latest patents include a paste transfer unit and an electronic component mounting device. One of his innovative methods involves measuring the film thickness of a coating film of a bonding paste formed on a transfer stage. This method utilizes a light interference technique and an optical type film thickness measuring sensor, allowing for automatic and accurate measurements without complicated procedures. Another patent details a method for determining solder paste height on circuit boards. This method captures a two-dimensional image from above the solder printed surface and determines the solder paste height based on pixel values, utilizing various color model luminance and intensity metrics.

Career Highlights

Throughout his career, Yousuke Hassaku has worked with prominent companies such as Panasonic Intellectual Property Management Co., Ltd. and Panasonic Corporation. His experience in these organizations has allowed him to refine his skills and contribute to advancements in electronic component technology.

Collaborations

Hassaku has collaborated with notable coworkers, including Masanori Ikeda and Masahiro Taniguchi. Their combined expertise has likely fostered innovative solutions in their respective fields.

Conclusion

Yousuke Hassaku's contributions to electronic component technology through his patents and collaborations highlight his role as an influential inventor. His innovative methods continue to enhance the efficiency of electronic manufacturing processes.

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