Panasonic Corporation

Panasonic Intellectual Property Management Co., Ltd.

Yousuke Hassaku

Masanori Ikeda

Michinori Tomomatsu

Masahiro Taniguchi

Hiroshi Okamura

Satoshi Furuichi

To measure a film thickness of a coating film () of a flux () serving as a bonding paste formed on a transfer stage () of a paste transfer unit (), the film thickness of the coating film () in a transfer area () is measured through a light-transmitting member () by a light interference method and by an optical type film thickness measuring sensor () which is arranged below the transfer stage (). Thus, it is possible to automatically and accurately measure the film thickness of the flux () in the transfer area () without requiring any complicated measurement work.

Paste transfer unit, electronic component mounting device, and transferred film thickness measuring method

A method of determining a solder paste height of solder paste printed on a circuit board, the method including obtaining a two-dimensional image of the circuit board which is captured from above a solder printed surface, and determining the solder paste height corresponding to a pixel value of each of pixels of the two-dimensional image, based on height information which defines a relationship between the pixel value and the solder paste height, the pixel value being a value representing at least one of luminance of red in a RGB color model, luminance of green in the RGB color model, luminance of blue in the RGB color model, hue in a HSI color model, saturation in the HSI color model, and intensity in the HSI color model.

Method of determining solder paste height and device for determining solder paste height

Growing community of inventors

Yamanashi, Japan

Yousuke Hassaku