Youngsuk Nam

Title: Youngsuk Nam: Semiconductor Packaging Innovation

Introduction

Youngsuk Nam is an inventor associated with Daejeon, South Korea. His patent work addresses heat management in semiconductor packages, where effective heat transfer can help protect components and support reliable operation.

Latest Patents

The provided information lists one patent for Nam: “Semiconductor Package with a Heat Dissipation Member and a Heat Transmission Member Comprising Phase Change Metal Particles.” The invention describes a package with a circuit board, a semiconductor chip, a heat-dissipation member, and a heat-transmission member positioned between the chip and the heat-dissipation member. The transmission member contains an insulating resin body and interconnected phase-change metal particles. These particles form a thermal path that carries heat from the chip to the heat-dissipation member. Nam’s listed patent count is 1 patent.

Career Highlights

The supplied career information associates Nam with Samsung Electronics Ltd. and the Korea Advanced Institute of Science and Technology. These organizations provide context for his work in semiconductor technology and research.

Collaborations

The listed coworkers associated with Nam are Jonggyu Lee and Seokkan Ki. Their names are provided as collaborators, though specific roles in the patent are not stated.

Conclusion

Youngsuk Nam’s listed invention focuses on improving heat transfer in semiconductor packages through interconnected phase-change metal particles, reflecting a practical approach to thermal management in electronic devices.