The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 20, 2026
Filed:
Nov. 17, 2023
Samsung Electronics Co., Ltd., Suwon-si, KR;
Jonggyu Lee, Suwon-si, KR;
Youngsuk Nam, Daejeon, KR;
Seokkan Ki, Daejeon, KR;
Jaechoon Kim, Suwon-si, KR;
Taehwan Kim, Suwon-si, KR;
SAMSUNG ELECTRONICS CO., LTD., Suwon-si, KR;
KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY, Daejeon, KR;
Abstract
Provided is a semiconductor package including a circuit board, a semiconductor chip on the circuit board, a heat dissipation member adjacent to the semiconductor chip, and a heat transmission member between the semiconductor chip and the heat dissipation member, the heat transmission member including a resin insulating body and phase change metal particles connected to each other in the resin insulating body, wherein the phase change metal particles connect the semiconductor chip and the heat dissipation member, the phase change metal particles being configured to transmit heat generated by the semiconductor chip to the heat dissipation member.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile