Youngkyu Lim

Title: Youngkyu Lim: Innovator in Semiconductor Packaging

Introduction: Youngkyu Lim is a prominent inventor based in Cheonan-si, South Korea, recognized for his contributions to the field of semiconductor packaging. With a portfolio of four patents, his innovative work is vital for improving the reliability and efficiency of electronic components.

Latest Patents: One of Youngkyu Lim's latest patents involves a novel package substrate and semiconductor package design. This patent outlines a package substrate that includes an insulation substrate, at least one redistribution layer (RDL), and a redistribution pad. An innovative feature of this design is the incorporation of segmenting grooves in a radial direction of the redistribution pad. This enhancement reduces the area of the redistribution pad, thereby minimizing physical stress on a passive interconnect device (PID) placed over the pad. As a result, the generation of cracks in the PID is decreased, and the reliability of the semiconductor package is significantly improved.

Career Highlights: Youngkyu Lim’s work at Samsung Electronics Co., Ltd. has established him as a key figure in the development of advanced semiconductor technologies. His expertise in designing highly effective package substrates demonstrates his commitment to enhancing the performance and durability of electronic devices.

Collaborations: Throughout his career, Youngkyu Lim has collaborated with esteemed colleagues such as Sunguk Lee and Gookmi Song. Their combined efforts contribute to ongoing advancements in semiconductor packaging, reflecting a strong team dynamic within Samsung Electronics.

Conclusion: Youngkyu Lim's innovative contributions in the realm of semiconductor packaging highlight his role as a leading inventor in the technology sector. His patents not only advance the field but also ensure that electronic devices are more reliable and efficient, benefiting consumers and industries alike.