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For the Inventor, By the Inventor

Daejeon, South Korea

Young-Taik Hong

USPTO Granted Patents = 8

Average Co-Inventor Count = 4.5

ph-index = 3

Forward Citations = 24(Granted Patents)


Location History:

  • Daejeon, KR (1996 - 2002)
  • Daejun, KR (2013)

Company Filing History:

goldMedal8 out of 623 
 
Korea Research Institute of Chemical Technology
 patents

Years Active: 1996-2013

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8 patents (USPTO):Explore Patents
1. 8419918 - Method of surface modification of polyimide film using ethyleneimines coupling agent, manufacturing method of flexible copper clad laminate and its product thereby (2013-04-16),
2. 6433184 - Polyamide-imide having head-to-tail backbone (2002-08-13),
3. 6018055 - Polyarylether containing N-substituted imide groups and process for (2000-01-25),
4. 5955568 - Process for preparing polyamideimide resins by direct polymerization (1999-09-21),
5. 5919942 - Cyclohexane-1,2,4,5-diimide derivative and process for preparing the same (1999-07-06),
6. 5824766 - Polyamideamic acid resin prepolymers, high heat resistant polyamideimide (1998-10-20),
7. 5532334 - Process for preparing polyamideimide resins having high molecular weight (1996-07-02),
8. 5521276 - Polyamideimide resins containing isophorone diamine structures (1996-05-28),

Title: Innovations of Young-Taik Hong: Advancements in Polyimide and Copper Clad Laminates

Introduction

Young-Taik Hong is a prominent inventor based in Daejeon, South Korea, known for his significant contributions to the field of chemical technology. With a total of eight patents to his name, he has developed innovative methods and materials that advance electronic components.

Latest Patents

Among his most notable patents is a method for the surface modification of polyimide film using ethyleneimine-based coupling agents. This innovative process includes a two-step plasma treatment, significantly enhancing the film's properties. His other key patent involves a manufacturing method for flexible copper clad laminates (FCCL), with remarkable adhesive strength, even under high-temperature conditions. This laminate is instrumental for electronic applications, such as flexible printed circuit boards and Chip On Film (COF) technologies. Additionally, he has developed polyamide-imides with a head-to-tail backbone structure that exhibit exceptional heat and chemical resistance, enhancing their utility across various applications.

Career Highlights

Currently, Young-Taik Hong is affiliated with the Korea Research Institute of Chemical Technology, where he has been instrumental in pioneering research and development in polymer chemistry. His innovative methodologies have not only contributed to academic knowledge but also to practical applications in the electronics industry.

Collaborations

Throughout his career, Young-Taik has collaborated with esteemed colleagues such as Kil-Yeong Choi and Mi-hie Yi. Their joint efforts in research have led to significant advancements in the field of flexible electronic materials and methods of production.

Conclusion

Young-Taik Hong stands out as a visionary inventor whose work in surface modification and material science continues to influence the landscape of electronic manufacturing. His patented technologies not only offer improved performance but also pave the way for future innovations in the industry.

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