The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 16, 2013
Filed:
May. 18, 2006
Young-taik Hong, Daejun, KR;
Hyung Dae Kang, Daejun, KR;
Seog Je Kim, Daejun, KR;
Jae Heung Lee, Daejun, KR;
Young-Taik Hong, Daejun, KR;
Hyung Dae Kang, Daejun, KR;
Seog Je Kim, Daejun, KR;
Jae Heung Lee, Daejun, KR;
Korea Research Institute of Chemical Technology, Yusung-gu, Daejun, KR;
Abstract
A method of surface modifying a polyimide film, a method of manufacturing a flexible copper clad laminate using the same, and a flexible copper clad laminate (FCCL) having a two-layer structure manufactured thereby. The method of surface modifying a polyimide film is conducted by modifying the surface of a polyimide film through a first plasma treatment, dipping the polyimide film into a solution containing an ethyleneimine-based silane coupling agent prepared by mixing the compound of Formula 1 and the compound of Formula 2 at a molar ratio of with 0.25˜1, and then modifying the surface of the polyimide film through a second plasma treatment. The method of surface modifying a polyimide film is advantageous because it may be substituted for a conventional surface treatment processes using ion beams. Also, the FCCL having a two-layer structure, formed by conducting copper sputtering and electroplating on the surface modified polyimide film, has good adhesive strength between the polyimide film and the copper foil and can maintain such adhesive strength even at high temperatures for a long period of time. Further, it may be usefully applied to electronic parts, such as flexible printed circuit boards, TCP (Tape Carrier Package), COF (Chip On Film), etc.