Company Filing History:
Years Active: 1993-2001
Title: Young I Kwon: Innovator in Integrated Circuit Packaging
Introduction
Young I Kwon is an accomplished inventor based in San Jose, California, renowned for his contributions to the field of integrated circuit technology. With an impressive portfolio of 10 patents, Kwon has made significant advancements, particularly in the packaging and cooling processes of integrated circuits.
Latest Patents
Kwon's innovative work includes several notable patents. One of his latest inventions is the "Multichip Module Packaging Process for Known Good Die Burn-In." This method involves packaging and testing integrated circuit dies by coupling the first integrated circuit to a substrate, encapsulating it, and then testing for functionality. If successful, a second integrated circuit can be coupled and encapsulated, forming a single monolithic multichip module. This process not only enhances efficiency but also mitigates the risk of costly failures by testing lower-value dies before encapsulating higher-value ones.
Another significant patent is the "Method and Apparatus for Cooling a Molded-Plastic Integrated-Circuit." This invention focuses on improving the cooling efficiency of molded package assemblies for integrated circuit dies. The design includes a molded-plastic package body with strategically placed through-holes for air circulation, facilitating effective cooling through convection. Additionally, cooling fins were designed to enhance airflow, further improving the reliability of the integrated circuits encapsulated within.
Career Highlights
Throughout his career, Young I Kwon has worked with prominent companies in the tech industry, including VLSI Technology, Inc. and S3 Graphics Co., Ltd. His work in these organizations has helped drive advancements in integrated circuit technologies and packaging solutions.
Collaborations
Kwon has collaborated with notable professionals in the field, including Louis H. Liang and Sang S. Lee. These partnerships have enabled him to enhance his inventions and contribute to innovative projects in the realm of integrated circuits.
Conclusion
Young I Kwon stands out as a prolific inventor in the integrated circuit domain, with his latest patents showcasing cutting-edge solutions for packaging and cooling processes. His contributions have significantly impacted the tech industry, reflecting his commitment to advancing technology and improving electronic systems.