The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 31, 1995
Filed:
Apr. 26, 1994
Young I Kwon, San Jose, CA (US);
VLSI Technology, Inc., San Jose, CA (US);
Abstract
Method and apparatus for connecting an I/O pad of an integrated circuit die to an electrical lead or contact on a lead frame that uses interposers formed directly on the die attach pad of the lead frame. Each interposer is formed by etching one or more grooves, preferably of depth no more than half the die attach pad thickness, in the die attach pad adjacent to the lead frame electrical lead(s). The exposed surfaces of the grooves and the die attach pad are coated with a layer of electrically insulating material, and the grooves are then filled with an electrically conducting material, such as conductive epoxy. An electrically conducting wire is then bonded between an I/O pad of an integrated circuit die and the electrically conducting material in the groove, and between the electrically conducting material and an electrical lead of a lead frame. Self-inductance and mutual inductance of the circuit line segments running from the die attach pad to the lead frame electrical lead(s) are reduced by control of the groove dimensions.