Company Filing History:
Years Active: 2017-2024
Title: Young Doo Jeon: Innovator in Semiconductor Packaging
Introduction
Young Doo Jeon is a prominent inventor based in San Jose, California. He has made significant contributions to the field of semiconductor packaging, holding three patents that showcase his innovative approach to technology.
Latest Patents
His latest patents include advancements in semiconductor packaging substrate fine pitch metal bump and reinforcement structures. These patents describe semiconductor packaging substrates and processing sequences. In one embodiment, a packaging substrate includes a build-up structure and a patterned metal contact layer that is partially embedded within the build-up structure and protrudes from it. The patterned metal contact layer may consist of an array of surface mount (SMT) metal bumps in a chip mount area, along with a metal dam structure or a combination thereof.
Career Highlights
Young Doo Jeon is currently employed at Apple Inc., where he continues to push the boundaries of semiconductor technology. His work has been instrumental in developing more efficient and effective packaging solutions for electronic components.
Collaborations
He collaborates with talented coworkers, including Jun Zhai and Chih-Ming Chung, who contribute to the innovative environment at Apple Inc.
Conclusion
Young Doo Jeon exemplifies the spirit of innovation in the semiconductor industry. His patents and contributions reflect a commitment to advancing technology and improving electronic packaging solutions.