Ithaca, NY, United States of America

Young Cheol Bae

This inventor holds 1 USPTO granted patent. Top assignee: Loctite Corporation. Active years: 2003.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Young Cheol Bae. Retrieved from https://idiyas.com/inventor/young-cheol-bae-hixttm1v

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


Average Co-Inventor Count = 5.0

ph-index = 1

Forward Citations = 12(Granted Patents)


Company Filing History:


Years Active: 2003

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1 patent (USPTO):Explore Patents

Title: Young Cheol Bae: Innovator in Thermosetting Resin Compositions

Introduction

Young Cheol Bae is a notable inventor based in Ithaca, NY (US). He has made significant contributions to the field of materials science, particularly in the development of thermosetting resin compositions. His work is essential for advancing technologies related to semiconductor devices.

Latest Patents

Young Cheol Bae holds a patent for "Reworkable thermosetting resin compositions." This invention pertains to thermosetting resin compositions that are useful for mounting semiconductor devices onto circuit boards. These devices include chip size or chip scale packages (CSPs), ball grid arrays (BGAs), and land grid arrays (LGAs). The compositions developed by Bae are reworkable under appropriate conditions, making them valuable in the semiconductor industry.

Career Highlights

Bae is currently associated with Loctite Corporation, where he continues to innovate and contribute to the field. His work has implications for improving the reliability and efficiency of semiconductor packaging.

Collaborations

Some of his coworkers include Lawrence N. Crane and Christopher Kemper Ober. Their collaboration enhances the research and development efforts at Loctite Corporation.

Conclusion

Young Cheol Bae's contributions to thermosetting resin compositions demonstrate his commitment to innovation in the semiconductor industry. His work not only advances technology but also paves the way for future developments in materials science.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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