The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 02, 2003
Filed:
Jul. 31, 2001
Applicant:
Inventors:
Lawrence N. Crane, Brookfield, CT (US);
Christopher K. Ober, Ithaca, NY (US);
Young Cheol Bae, Ithaca, NY (US);
Shuyan Yu, Hiroshima, JP;
Jong-Wook Park, Chumgbuk, KR;
Assignee:
Loctite Corporation, Rocky Hill, CT (US);
Primary Examiner:
Int. Cl.
CPC ...
C08F / ;
U.S. Cl.
CPC ...
C08F / ;
Abstract
This invention relates to thermosetting resin compositions useful for mounting semiconductor devices onto a circuit board, such as chip size or chip scale packages (“CSPs”), ball grid arrays (“BGAs”), land grid arrays (“LGAs”), and the like, each of which having a semiconductor chip, such as large scale integration (“LSI”), on a carrier substrate. The compositions of this invention are reworkable when subjected to appropriate conditions.