This inventor holds 1 USPTO granted patent and 1 published patent application. Top assignee: Harima Chemicals, Incorporated. Active years: 2008.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2008
Title: Youichi Kukimoto: Innovator in Solder Deposition Technology
Introduction
Youichi Kukimoto is a notable inventor based in Kakogawa, Japan. He has made significant contributions to the field of solder deposition technology, particularly with his innovative methods that enhance the precision and efficiency of solder application.
Latest Patents
Kukimoto holds a patent for a solder deposition method and solder bump forming method. This invention provides a solder deposition technique that includes forming a dam around an electrode on a substrate, applying a solder precipitating composition, and depositing solder on the electrode's surface while heating the composition. This method is particularly effective for creating large bumps at fine pitches, allowing for precise height control and minimizing the occurrence of voids.
Career Highlights
Kukimoto is associated with Harima Chemicals, Incorporated, where he has been instrumental in advancing solder technology. His work has been recognized for its practical applications in various electronic manufacturing processes.
Collaborations
Kukimoto has collaborated with notable colleagues, including Kenshu Oyama and Hitoshi Sakurai, contributing to the development of innovative solutions in the field.
Conclusion
Youichi Kukimoto's contributions to solder deposition technology exemplify the impact of innovative thinking in engineering. His patented methods continue to influence the industry, showcasing the importance of precision in electronic manufacturing.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile