The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 18, 2008
Filed:
Jan. 29, 2004
Youichi Kukimoto, Kakogawa, JP;
Hitoshi Sakurai, Kakogawa, JP;
Seishi Kumamoto, Kakogawa, JP;
Kenshu Oyama, Kakogawa, JP;
Youichi Kukimoto, Kakogawa, JP;
Hitoshi Sakurai, Kakogawa, JP;
Seishi Kumamoto, Kakogawa, JP;
Kenshu Oyama, Kakogawa, JP;
Harima Chemicals, Inc., Hyogo, JP;
Abstract
The present invention provides a solder deposition method that includes the step of forming a dam around an electrode on a substrate, the step of applying a solder precipitating composition to the substrate, and the step of depositing solder on the surface of the electrode while heating the solder precipitating composition applied. This solder deposition method is suitable for forming large bumps at fine pitches. In particular, it is capable of depositing solder in a desired height precisely and easily, and yet preventing occurrence of voids.