This inventor holds 1 USPTO granted patent. Top assignee: Futaba Denshi Kogyo K.k.. Active years: 1997.
Company Filing History:
Years Active: 1997
Title: Youich Kogure: Innovator in Sealed Envelope Technology
Introduction
Youich Kogure is a notable inventor based in Mobara, Japan. He has made significant contributions to the field of envelope technology, particularly through his innovative methods for sealed bonding substrates.
Latest Patents
Kogure holds a patent for a "Method for sealedly forming envelope." This invention describes a process and apparatus that allows for the sealed bonding of an anode substrate and a cathode substrate. The method ensures that misregistration between the substrates is prevented. A sealing glass material is strategically arranged on the periphery of one substrate, while the other substrate is placed on top. The two substrates are then registered, and a laser beam is directed onto the sealing glass material through the anode substrate. This process locally melts the sealing glass, temporarily bonding the substrates. Finally, both substrates are heated in an oven, resulting in a securely sealed envelope.
Career Highlights
Kogure is associated with Futaba Denshi Kogyo K.K., where he has been able to apply his innovative ideas in a practical setting. His work has led to advancements in the manufacturing processes of sealed envelopes, showcasing his expertise in the field.
Collaborations
Kogure has collaborated with notable colleagues such as Akira Kadowaki and Takeshi Tonegawa. Their combined efforts have contributed to the development of new technologies and methods in their respective fields.
Conclusion
Youich Kogure's innovative approach to sealed envelope technology has made a significant impact in the industry. His patent reflects a commitment to improving manufacturing processes and ensuring quality in product development.