The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 02, 1997
Filed:
Jul. 06, 1995
Akira Kadowaki, Mobara, JP;
Shigeo Itoh, Mobara, JP;
Youich Kogure, Mobara, JP;
Takeshi Tonegawa, Mobara, JP;
Futaba Denshi Kogyo K.K., Mobara, JP;
Abstract
A method for sealedly forming an envelope and an apparatus therefor capable of sealedly bonding an anode substrate and a cathode substrate to each other while preventing misregistration therebetween. A sealing glass material is arranged on a periphery of one of the substrates and the other substrate is put on the one substrate. Then, both substrates are registered with each other and then a laser beam is downwardly irradiated on the sealing glass material through the anode substrate to locally melt the sealing glass material, to thereby temporarily bond both substrates to each other. Then, both substrates are heated in an oven, to thereby sealedly bonded to each other, resulting in sealedly forming an envelope.