Wuhan, China

Youdong Jiang

This inventor holds 1 USPTO granted patent and 2 published patent applications. Top assignee: Yangtze Memory Technologies Co., Ltd.. Active years: 2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Youdong Jiang. Retrieved from https://idiyas.com/inventor/youdong-jiang

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 1 

% Patents Active = 100.0

Average Co-Inventor Count = 4.0

ph-index = 1


Company Filing History:


Years Active: 2025

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1 patent (USPTO):Explore Patents

Title: Youdong Jiang: Innovator in Wafer Bonding Technology

Introduction

Youdong Jiang is a prominent inventor based in Wuhan, China. He is known for his contributions to the field of semiconductor technology, particularly in wafer bonding methods. With a focus on innovation, Jiang has developed techniques that enhance the efficiency and effectiveness of semiconductor manufacturing.

Latest Patents

Jiang holds a patent for a "Wafer bonding method and bonded wafer." This method involves several key steps: forming a first hole in a first insulation layer over a first substrate, performing a first deposition-self-etch process to deposit a first conductive material in the first hole to create a first conductive plug, forming a second hole in a second insulation layer over a second substrate, and performing a second deposition-self-etch process to deposit a second conductive material in the second hole to create a second conductive plug. The process culminates in bonding the first conductive plug with the second conductive plug, resulting in a first grain fusion layer between the two conductive plugs. Jiang's innovative approach has the potential to significantly improve the performance of bonded wafers.

Career Highlights

Youdong Jiang is currently employed at Yangtze Memory Technologies Co., Ltd. His work at this leading technology company has allowed him to apply his expertise in wafer bonding and contribute to advancements in memory technology. Jiang's dedication to research and development has positioned him as a key player in the semiconductor industry.

Collaborations

Throughout his career, Jiang has collaborated with notable colleagues, including Chao Wang and Yulong Zhang. These partnerships have fostered a collaborative environment that encourages innovation and the sharing of ideas.

Conclusion

Youdong Jiang's contributions to wafer bonding technology exemplify the spirit of innovation in the semiconductor industry. His patent and work at Yangtze Memory Technologies Co., Ltd. highlight his commitment to advancing technology and improving manufacturing processes. Jiang's achievements serve as an inspiration for future inventors in the field.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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