This inventor holds 1 USPTO granted patent and 2 published patent applications. Top assignee: Furukawa Electric., Ltd.. Active years: 2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2026
Title: Yota Otani: Semiconductor Materials Inventor.
Introduction
Yota Otani is an inventor based in Tokyo, Japan, whose patent work concerns materials and manufacturing processes for semiconductor packaging. He is associated with Furukawa Electric Co., Ltd.
Latest Patents
Otani is named on 1 patent: “Dicing Die Attach Film and Method of Producing the Same, and Semiconductor Package and Method of Producing the Same.” The invention describes a layered film combining a dicing film and a die attach film. The die attach film contains an organic solvent with a boiling point of at least 100°C but below 150°C and a vapor pressure of no more than 50 mmHg, subject to a specified condition on the solvent amount.
Career Highlights
Otani’s listed patent reflects work on dicing and die-attachment materials used in semiconductor manufacturing. The invention also addresses methods for producing the film and semiconductor package.
Collaborations
Otani’s listed coworkers include Minoru Morita and Hiromitsu Maruyama. Their shared patent work connects their names with the development of the dicing die attach film and related semiconductor-package processes.
Conclusion
Yota Otani’s patent highlights his contribution to semiconductor materials and packaging processes through an invention focused on dicing die attach film and its production.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile