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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12751310 B1

PDFFull Text
Date of Patent:
Sep. 29, 2026

Filed:

May. 27, 2022

Dicing die attach film and method of producing the same, and semiconductor package and method of producing the same

Applicant:

Furukawa Electric Co., Ltd., Tokyo, JP;

Inventors:

Minoru Morita, Tokyo, JP;

Yota Otani, Tokyo, JP;

Hiromitsu Maruyama, Tokyo, JP;

Assignee:

FURUKAWA ELECTRIC CO., LTD., Tokyo, JP;

Attorney:

Birch, Stewart, Kolasch & Birch, LLP

Primary Examiner:

Leonard Chang

Assistant Examiner:

Stanetta D Isaac

Int. Cl.
CPC ...
H10W 72/00 (2026.01); H10W 72/30 (2026.01); H10W 90/00 (2026.01); H10W 90/20 (2026.01); H10W 90/24 (2026.01);
U.S. Cl.
CPC ...
H10W 72/0198 (2026.01); H10W 90/00 (2026.01); H10W 72/01357 (2026.01); H10W 72/01361 (2026.01); H10W 72/07304 (2026.01); H10W 72/07332 (2026.01); H10W 72/07338 (2026.01); H10W 72/325 (2026.01); H10W 72/352 (2026.01); H10W 72/354 (2026.01); H10W 72/884 (2026.01); H10W 90/20 (2026.01); H10W 90/24 (2026.01); H10W 90/732 (2026.01); H10W 90/734 (2026.01); H10W 90/754 (2026.01);
Abstract

A dicing die attach film containing a dicing film and a die attach film stacked on the dicing film, wherein the die attach film contains an organic solvent having a boiling point of 100° C. or more and less than 150° C. and a vapor pressure of 50 mmHg or less, and wherein an amount of the organic solvent in the die attach film satisfies the following (a):

Find Patent Forward Citations

Morita, Minoru. (2026). Dicing die attach film and method of producing the same, and semiconductor package and method of producing the same (U.S. Patent No. 12751310). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12751310

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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