Location History:
- Tokyo, JP (1999)
- Fussa, JP (1998 - 2006)
Company Filing History:
Years Active: 1998-2006
Title: Innovations by Yoshiyuki Ogata
Introduction
Yoshiyuki Ogata is a notable inventor based in Fussa, Japan. He has made significant contributions to the field of semiconductor technology, holding a total of 3 patents. His work focuses on improving the efficiency and accuracy of semiconductor bonding processes.
Latest Patents
One of his latest patents is a die bonding method and apparatus. This innovation allows for bonding position detection and bonding inspection without compromising productivity. After a bonding head has attached a semiconductor chip to an island, it moves to a wafer to pick up another chip and returns to the island. During this time, a camera captures images of both the island used for bonding inspection and the island for position detection. This enables inspection of bonding conditions and position detection based on the acquired image data.
Another significant patent is a ball detection method and apparatus for wire-bonded parts. This invention determines the position, size, and shape of a ball formed on a pad of a semiconductor chip when a wire is bonded between the pad and a lead frame. The ball is detected in at least three directions from the center towards the edge, ensuring precise measurements.
Career Highlights
Yoshiyuki Ogata is currently employed at Kabushiki Kaisha Shinkawa, where he continues to innovate in semiconductor technology. His work has been instrumental in advancing the methods used in the industry.
Collaborations
He collaborates with talented coworkers, including Nobuto Yamazaki and Hiromi Tomiyama, who contribute to the innovative environment at Kabushiki Kaisha Shinkawa.
Conclusion
Yoshiyuki Ogata's contributions to semiconductor technology through his patents demonstrate his commitment to innovation and efficiency in the industry. His work continues to influence advancements in the field.