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For the Inventor, By the Inventor

Amagasaki, Japan

Yoshiyuki Morihiro

This inventor holds 10 USPTO granted patents. Top assignee: Mitsubishi Denki Kabushiki Kaisha. Active years: 1981-1995.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Yoshiyuki Morihiro. Retrieved from https://idiyas.com/inventor/yoshiyuki-morihiro

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 10

% Patents Active = 100.0

Average Co-Inventor Count = 3.4

ph-index = 6

Forward Citations = 154(Granted Patents)


Company Filing History:

goldMedal10 out of 21,351 
 
Mitsubishi Denki Kabushiki Kaisha
 patents

Years Active: 1981-1995

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10 patents (USPTO):Explore Patents
1. 5443659 - Flux for soldering and solder composition comprising the same and (1995-08-22),
2. 5175399 - Wiring panel including wiring having a surface-reforming layer and (1992-12-29),
3. 5034569 - Multilayer interconnection circuit board (1991-07-23),
4. 4914815 - Method for manufacturing hybrid integrated circuits (1990-04-10),
5. 4783642 - Hybrid integrated circuit substrate and method of manufacturing the same (1988-11-08),
6. 4752555 - Method of manufacturing multilayer circuit board (1988-06-21),
7. 4685203 - Hybrid integrated circuit substrate and method of manufacturing the same (1987-08-11),
8. 4643798 - Composite and circuit board having conductive layer on resin layer and (1987-02-17),
9. 4629681 - Method of manufacturing multilayer circuit board (1986-12-16),
10. 4291758 - Preparation of boiling heat transfer surface (1981-09-29),

Title: Innovations of Yoshiyuki Morihiro

Introduction

Yoshiyuki Morihiro is a prominent inventor based in Amagasaki, Japan. He has made significant contributions to the field of soldering technology, holding a total of 10 patents. His work focuses on improving soldering methods and materials, which are essential in various electronic applications.

Latest Patents

Morihiro's latest patents include innovative solutions such as a flux for soldering and a solder composition that incorporates this flux. His inventions also feature a flux for soldering that comprises an inorganic ion-exchanger and an activator containing a halogen atom. Additionally, he has developed soldering methods that involve coating the solder composition on a portion for soldering and applying the inorganic ion-exchanger and solder to the designated area. These methods are designed to enhance metal ion-migration resistance, corrosion resistance, soldering properties, and storage stability, making them suitable for practical no-clean soldering applications. Furthermore, he has worked on a wiring panel that includes a surface-reforming layer to suppress electron transfer, showcasing his commitment to advancing electronic component technology.

Career Highlights

Yoshiyuki Morihiro is associated with Mitsubishi Electric Corporation, where he continues to innovate in the field of soldering and wiring technologies. His extensive experience and expertise have positioned him as a key figure in the development of advanced soldering materials and methods.

Collaborations

Morihiro has collaborated with notable colleagues such as Mitsuyuki Takada and Hayato Takasago. Their combined efforts have contributed to the advancement of soldering technologies and the development of new materials.

Conclusion

Yoshiyuki Morihiro's contributions to soldering technology through his patents and collaborations highlight his role as an influential inventor in the field. His work continues to impact the electronics industry positively.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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