The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 17, 1987
Filed:
Apr. 09, 1985
Mitsubishi Denki Kabushiki Kaisha, Tokyo, JP;
Abstract
In manufacturing a composite having a conductive layer on the surface of a resin layer, first the resin layer of a mixture of a resin material and filler elements is formed on a substrate and the resin material of the surface of the resin layer is selectively etched with respect to the filler elements to expose a portion of the filler elements, and then the filler elements, as exposed on the selectively etched surface of the resin layer, are selectively etched with respect to the resin material to form unevenness. Then catalyst nuclei are formed for electroless plating on the selectively etched surface having the unevenness and then a conductive metallic layer is formed by an electroless plating process on the selectively etched surface having unevenness. As a result, a composite of the above described structure is provided.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile