Amagasaki, Japan

Mitsuyuki Takada


Average Co-Inventor Count = 3.5

ph-index = 10

Forward Citations = 406(Granted Patents)


Location History:

  • Hyogo, JP (1990 - 1992)
  • Amagasaki, JP (1986 - 1998)

Company Filing History:


Years Active: 1986-1998

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21 patents (USPTO):Explore Patents

Title: Mitsuyuki Takada: Innovator in Semiconductor Packaging

Introduction

Mitsuyuki Takada, hailing from Amagasaki, Japan, is a distinguished inventor with an impressive portfolio of 21 patents. His work primarily focuses on advancing semiconductor packaging technology, contributing significantly to the efficiency and functionality of high-frequency devices.

Latest Patents

Among Takada's latest innovations, one notable patent is the "Cu/Mo/Cu clad mounting for high frequency devices." This invention describes a semiconductor package and its manufacturing method that utilizes a Cu/Mo/Cu clad material for a base plate. This innovative design allows for an inexpensive package with high thermal conductivity, which also aligns with the thermal expansion of semiconductor chips. Additionally, it features an optimal configuration for lead sizes and plating techniques, enhancing the heat transfer efficiency while ensuring impedance matching.

Another significant patent by Takada is the "Evaluation board for evaluating electrical characteristics of an IC." This evaluation board consists of an electrically insulating support board equipped with signal wire patterns for measurement probe contacts and mounting pads for solder ball connections. The design ingeniously connects these elements through strategically placed through holes, effectively maintaining signal integrity and ensuring reliable evaluation of electrical characteristics.

Career Highlights

Mitsuyuki Takada is currently employed at Mitsubishi Electric Corporation, where he continues to push the boundaries of semiconductor technology. His contributions in this role have established him as a leading figure in the innovation landscape of high-frequency device packaging.

Collaborations

Throughout his career, Takada has collaborated with talented coworkers such as Hayato Takasago and Eishi Gofuku. Together, they have contributed to advancements in semiconductor technology, showcasing the power of teamwork in innovation.

Conclusion

Mitsuyuki Takada exemplifies the spirit of innovation within the semiconductor industry. His 21 patents highlight his commitment to improving the functionality and efficiency of electronic devices, making significant strides along the way. With continued collaboration and development, Takada is poised to contribute even more groundbreaking advancements to the field.

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