The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 03, 1991
Filed:
Aug. 24, 1990
Applicant:
Inventors:
Hirofumi Ohuchida, Amagasaki, JP;
Eishi Gofuku, Amagasaki, JP;
Hayato Takasago, Amagasaki, JP;
Akira Ishizu, Amagasaki, JP;
Toshio Tobita, Amagasaki, JP;
Mitsuyuki Takada, Amagasaki, JP;
Assignee:
Mitsubishi Denki Kabushiki Kaisha, Tokyo, JP;
Primary Examiner:
Int. Cl.
CPC ...
B44C / ; B29C / ; B32B / ; B23K / ;
U.S. Cl.
CPC ...
156630 ; 156633 ; 156643 ; 156655 ; 1562728 ; 1563041 ; 21912169 ;
Abstract
A process for preparing a combined wiring substrate is carried out by bonding with an adhesive agent the end surfaces of the mutually opposing sides of a plurality of substrates each having a pattern of wiring on its major surface, and by connecting electrically parts of the pattern of wiring which oppose each other by interposing the bonding portion.