Yoshiyuki Miyoshi

Title: Innovations by Yoshiyuki Miyoshi in Copper Foil Technology

Introduction

Yoshiyuki Miyoshi, an accomplished inventor based in Ibaraki, Japan, has made significant contributions to the field of copper foil technology. With one patent to his name, Miyoshi's work particularly focuses on enhancing the efficiency and usability of printed wiring boards. His innovative approach is characterized by his dedication to engineering solutions that streamline manufacturing processes.

Latest Patents

Miyoshi holds a notable patent titled "Copper foil provided with carrier, laminate, printed wiring board, and method for fabricating printed wiring board". This invention presents a copper foil integrated with a carrier that facilitates the effective peeling of an ultrathin copper layer during laminate production. The design includes a carrier, an intermediate layer, and an ultrathin copper layer, characterized by a ten-point average roughness of 6.0 µm or less on the carrier surface when measured with a laser microscope. This advancement is pivotal for improving the quality and performance of printed wiring boards.

Career Highlights

Yoshiyuki Miyoshi is associated with JX Nippon Mining & Metals Corporation, a leading entity in the copper materials sector. His expertise and inventive spirit have enabled him to carve a niche in technologies that address the challenges faced in the production of electronic components. Through his work, he has demonstrated a commitment to advancing manufacturing standards and efficiency.

Collaborations

Miyoshi’s innovative journey includes collaboration with skilled professionals such as Michiya Kohiki and Masafumi Ishii. Working alongside these talented individuals has fostered a creative environment that encourages the exchange of ideas, resulting in cutting-edge advancements in copper foil technology.

Conclusion

Yoshiyuki Miyoshi stands out as a notable inventor whose work is reshaping the landscape of copper foil applications in the technology sector. His patent demonstrates not just technical skill, but a visionary approach to addressing practical challenges in manufacturing. The innovations he brings forth contribute significantly to the ongoing evolution of printed wiring board technology.