The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 08, 2019
Filed:
Jan. 20, 2016
Applicant:
Jx Nippon Mining & Metals Corporation, Tokyo, JP;
Inventors:
Assignee:
JX Nippon Mining & Metals Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 3/02 (2006.01); H05K 1/09 (2006.01); C25D 5/10 (2006.01); C25D 7/06 (2006.01); H05K 3/20 (2006.01); H05K 3/40 (2006.01); H05K 3/42 (2006.01); C25D 1/04 (2006.01); C25D 3/38 (2006.01); C25D 5/02 (2006.01);
U.S. Cl.
CPC ...
H05K 3/025 (2013.01); C25D 5/10 (2013.01); C25D 7/0614 (2013.01); C25D 1/04 (2013.01); C25D 3/38 (2013.01); C25D 5/022 (2013.01); H05K 3/205 (2013.01); H05K 3/4007 (2013.01); H05K 3/421 (2013.01); H05K 2203/0152 (2013.01); H05K 2203/0156 (2013.01); H05K 2203/0307 (2013.01); H05K 2203/0723 (2013.01); H05K 2203/0726 (2013.01);
Abstract
Provided is a copper foil provided with a carrier which enables, in a laminate produced by laminating a copper foil provided with a carrier on a resin substrate, to peel the ultrathin copper layer from the carrier well. A copper foil provided with a carrier having, in order, a carrier, an intermediate layer, and an ultrathin copper layer, wherein, when the surface of the carrier opposite to the ultrathin copper layer is measured using a laser microscope based on JIS B0601-1994, the ten point average roughness Rz of the surface is 6.0 μm or less.