Kyoto, Japan

Yoshito Nishizawa

This inventor holds 4 USPTO granted patents and 1 EPO patent. Top assignees: Fukuda Metal Foil & Powder Co., Ltd., Daihen Corporation, Technology Research Association for Future Additive Manufacturing. Active years: 2021-2023.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Yoshito Nishizawa. Retrieved from https://idiyas.com/inventor/yoshito-nishizawa

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 75.0

 

Average Co-Inventor Count = 5.5

ph-index = 1


Location History:

  • Kyoto, JP (2021)
  • Shiga, JP (2023)

Company Filing History:


Years Active: 2021-2023

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4 patents (USPTO):Explore Patents

Title: Innovations of Yoshito Nishizawa in Copper Powder Technology

Introduction

Yoshito Nishizawa is a notable inventor based in Kyoto, Japan. He has made significant contributions to the field of materials science, particularly in the development of copper powders for advanced manufacturing techniques. With a total of four patents to his name, his work focuses on enhancing the properties of copper for various applications.

Latest Patents

Nishizawa's latest patents include innovations in lamination shaping copper powder. One of his inventions involves a copper powder to which tin (Sn) is added. This innovation allows for the creation of a high-density laminated and shaped product using a fiber laser as a heat source. By appropriately reducing the electrical conductivity of copper, this method results in a product that maintains both high density and high electrical conductivity. The copper powder is designed to contain 0.5 wt % or more of the tin element, with an optimal range of 5.0 wt % or more. Additionally, when the product achieves sufficient electrical conductivity, the copper powder should contain 6.0 wt % or less of the tin element.

Another significant patent involves a copper powder with added phosphorus (P). This invention also aims to produce a high-density laminated and shaped product using a fiber laser. The copper powder is formulated to contain 0.01 wt % or more of the phosphorus element, with a desirable range of 0.04 wt % or more. The maximum recommended phosphorus content is 0.30 wt %, ensuring that no other elements are added to the copper powder.

Career Highlights

Throughout his career, Yoshito Nishizawa has worked with prominent companies such as Fukuda Metal Foil & Powder Co., Ltd. and the Technology Research Association for Future Additive Manufacturing. His experience in these organizations has contributed to his expertise in the field of additive manufacturing and material development.

Collaborations

Nishizawa has collaborated with notable colleagues, including Takeshi Maruyama and Hiroaki Okubo. These partnerships have likely facilitated the advancement of his research and innovations in copper powder technology.

Conclusion

Yoshito Nishizawa's contributions to the field of copper powder technology demonstrate his commitment to innovation and excellence. His patents reflect a deep understanding of material properties and their applications in modern manufacturing processes. Through his work, he continues to influence the industry and pave the way

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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