The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 30, 2021
Filed:
Feb. 06, 2019
Applicants:
Daihen Corporation, Osaka, JP;
Fukuda Metal Foil & Powder Co., Ltd., Kyoto, JP;
Inventors:
Ryusuke Tsubota, Osaka, JP;
Junichi Tanaka, Osaka, JP;
Yohei Oka, Osaka, JP;
Akira Okamoto, Osaka, JP;
Masato Kikukawa, Kyoto, JP;
Hiroaki Okubo, Kyoto, JP;
Yoshito Nishizawa, Kyoto, JP;
Takeshi Maruyama, Kyoto, JP;
Motonori Nishida, Kyoto, JP;
Assignees:
DAIHEN CORPORATION, Osaka, JP;
FUKUDA METAL FOIL & POWDER CO., LTD., Osaka, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B22F 10/20 (2021.01); C22C 1/04 (2006.01); B22F 10/00 (2021.01); B33Y 10/00 (2015.01); B33Y 80/00 (2015.01); B22F 1/00 (2006.01); C22C 9/01 (2006.01); C22F 1/08 (2006.01); B22F 3/24 (2006.01); B33Y 70/00 (2020.01);
U.S. Cl.
CPC ...
B22F 10/20 (2021.01); B22F 1/0003 (2013.01); B22F 10/00 (2021.01); B33Y 10/00 (2014.12); B33Y 70/00 (2014.12); B33Y 80/00 (2014.12); C22C 1/0425 (2013.01); C22C 9/01 (2013.01); C22F 1/08 (2013.01); B22F 2003/248 (2013.01); B22F 2301/052 (2013.01); B22F 2301/10 (2013.01); B22F 2998/10 (2013.01); Y02P 10/25 (2015.11);
Abstract
A metal powder for additive manufacturing includes: not less than 0.2 mass % and not more than 1.3 mass % of aluminum; and a balance including copper and an incidental impurity.