This inventor holds 1 USPTO granted patent. Top assignee: C.uyemura Co., Ltd.. Active years: 2021.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2021
Title: Innovations by Yoshito Ii
Introduction
Yoshito Ii is a notable inventor based in Osaka, Japan. He has made significant contributions to the field of conductive materials, particularly in the development of innovative bump technologies. His work focuses on enhancing the performance and reliability of electronic components.
Latest Patents
Yoshito Ii holds a patent for a "Conductive bump and electroless Pt plating bath." This invention provides a bump that can prevent the diffusion of a metal used as a base conductive layer into the surface of an Au layer or an Ag layer. The conductive bump is formed on a substrate and comprises specific layers that enhance its functionality.
Career Highlights
Yoshito Ii is associated with C. Uyemura Co., Ltd., where he has been instrumental in advancing the company's technological capabilities. His expertise in conductive materials has positioned him as a key figure in the industry.
Collaborations
Yoshito has collaborated with talented individuals such as Sho Kanzaki and Takuma Maekawa. These partnerships have fostered innovation and contributed to the success of their projects.
Conclusion
Yoshito Ii's contributions to the field of conductive materials and his innovative patent demonstrate his commitment to advancing technology. His work continues to influence the industry and inspire future innovations.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile