Aizuwakamatsu, Japan

Yoshiteru Akisaka


Average Co-Inventor Count = 4.6

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:


Years Active: 2021-2024

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3 patents (USPTO):Explore Patents

Title: Innovations of Yoshiteru Akisaka

Introduction

Yoshiteru Akisaka is a notable inventor based in Aizuwakamatsu, Japan. He has made significant contributions to the field of materials science, particularly in the development of advanced copper alloys. With a total of 3 patents to his name, Akisaka's work has implications for various electronic and electric devices.

Latest Patents

Akasaka's latest patents include innovative advancements in copper alloy sheets. One of his patents focuses on a copper alloy plate that features a specific magnesium (Mg) concentration, which enhances its properties. The patent details a method for producing a copper alloy sheet with a center Mg concentration of 0.1 mass % or more and less than 0.3 mass %, along with a center phosphorus (P) concentration of 0.001 mass % or more and 0.2 mass % or less. This invention aims to improve the surface characteristics and electrical contact resistance of the alloy. Another patent involves a copper alloy designed specifically for electronic and electric devices, which includes precise ratios of Mg and P to optimize performance.

Career Highlights

Yoshiteru Akisaka is currently employed at Mitsubishi Materials Corporation, where he continues to innovate in the field of materials engineering. His work has been instrumental in advancing the capabilities of copper alloys used in various applications.

Collaborations

Akasaka collaborates with talented coworkers such as Kazunari Maki and Hirotaka Matsunaga. Their combined expertise contributes to the development of cutting-edge materials that meet the demands of modern technology.

Conclusion

Yoshiteru Akisaka's contributions to the field of copper alloys demonstrate his commitment to innovation and excellence. His patents reflect a deep understanding of material properties and their applications in electronic devices.

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