Sayama, Japan

Yoshimitsu Ogawa


Average Co-Inventor Count = 2.9

ph-index = 2

Forward Citations = 5(Granted Patents)


Location History:

  • Sayama, JP (2000 - 2011)
  • Tochigi-ken, JP (2021)

Company Filing History:


Years Active: 2000-2021

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5 patents (USPTO):Explore Patents

Title: Innovations of Yoshimitsu Ogawa

Introduction

Yoshimitsu Ogawa is a notable inventor based in Sayama, Japan. He has made significant contributions to the field of plating technology, holding a total of 5 patents. His work focuses on advancements in zinc-nickel composite plating, which has applications in various industries.

Latest Patents

Ogawa's latest patents include innovative technologies such as a zinc-nickel composite plating bath and a plating apparatus. The zinc-nickel composite plating bath is designed to contain a zinc source, a nickel source, silicon dioxide particles, and an ammonium-based dispersant. This formulation allows for the achievement of a zinc-nickel composite plating film with a nickel codeposition amount of 10-16 wt % and a silicon dioxide particle codeposition amount of 7 vol % or more. The pH of this plating bath is maintained between 5.6 to 6.8. Additionally, his plating apparatus features a tubular electrode placed in a hollow section of the workpiece, facilitating a unique flow of plating liquid that enhances the efficiency of the plating process.

Career Highlights

Throughout his career, Ogawa has worked with prominent companies, including Honda Motor Co., Ltd. and Honda Giken Kogyo Kabushiki Kaisha. His experience in these organizations has contributed to his expertise in plating technologies and innovations.

Collaborations

Ogawa has collaborated with notable colleagues such as Osamu Ishigami and Tomohiro Hirata. Their teamwork has likely fostered advancements in their respective fields.

Conclusion

Yoshimitsu Ogawa's contributions to plating technology through his patents and collaborations highlight his role as an influential inventor. His work continues to impact the industry positively.

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