The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 11, 2011

Filed:

May. 10, 2005
Applicants:

Yoshimitsu Ogawa, Sayama, JP;

Hajime Miyasaka, Sayama, JP;

Inventors:

Yoshimitsu Ogawa, Sayama, JP;

Hajime Miyasaka, Sayama, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C25D 5/02 (2006.01); C25D 5/08 (2006.01); C25D 17/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A plating apparatus has a tubular electrode () placed in a hollow section () of work (). The tubular electrode () has a through-hole () formed in the longitudinal direction. A circular tube-like gap (S) in which a plating liquid () flows is formed between the tubular electrode placed in the hollow section and an inner peripheral wall () of the hollow section. The plating liquid flows spirally from the lower end of the gap to the upper end by action of a vortex producing flow path () communicating to the lower end of the gap. The plating liquid having reached the upper end circulates through the through-hole of the tubular electrode.


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