The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 7022419 B1

PDF
Full Text
Expired
Date of Patent:
Apr. 04, 2006

Filed:

Dec. 12, 2001
Applicants:

Osamu Ishigami, Sayama, JP;

Tomohiro Hirata, Sayama, JP;

Yoshimitsu Ogawa, Sayama, JP;

Nobuhiko Yoshimoto, Sayama, JP;

Inventors:

Osamu Ishigami, Sayama, JP;

Tomohiro Hirata, Sayama, JP;

Yoshimitsu Ogawa, Sayama, JP;

Nobuhiko Yoshimoto, Sayama, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 15/20 (2006.01);
U.S. Cl.
CPC ...
Abstract

A composite nickel and copper alloy plating film () containing nickel and copper. Nickel is of high wear resistance and a nickel alloy improves the wear resistance of the film. Copper is of high resistance of the film. The film may further contain self-lubricating particles and hard particles which ensure its wear resistance and lubricating property to a further extent.


Find Patent Forward Citations

Ishigami, Osamu. (2006). Composite plating film and a process for forming the same (U.S. Patent No. 7022419). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7022419

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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