Company Filing History:
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Years Active: 2017-2020
Title: The Innovations of Yoshimichi Ohki
Introduction
Yoshimichi Ohki is a notable inventor based in Tokyo, Japan. He has made significant contributions to the field of printed circuit board technology. With a total of 2 patents, his work focuses on enhancing the performance and reliability of electronic components.
Latest Patents
One of Yoshimichi Ohki's latest patents is a metal-base printed circuit board designed to be highly thermally conductive. This innovation prevents electrochemical migration by inhibiting the elution of copper ions. The printed circuit board consists of a metal base plate, an insulating resin layer, and a copper foil layer stacked in that order. The insulating resin layer contains a first inorganic filler made of particles with diameters ranging from 0.1 nm to 600 nm, with an average particle diameter of 1 nm to 300 nm. Additionally, it includes a second inorganic filler made of particles with diameters from 100 nm to 100 µm, with an average particle diameter of 500 nm to 20 µm. Both fillers are uniformly dispersed within the insulating resin layer.
Career Highlights
Yoshimichi Ohki has worked with prestigious organizations such as Waseda University and Fuji Electric Co., Ltd. His experience in these institutions has allowed him to develop and refine his innovative ideas in the field of electronics.
Collaborations
Some of his notable coworkers include Yuichi Hirose and Genta Wada. Their collaboration has contributed to the advancement of technology in their respective fields.
Conclusion
Yoshimichi Ohki's contributions to printed circuit board technology demonstrate his commitment to innovation and excellence. His patents reflect a deep understanding of materials and their applications in electronics.