Fuji Electric Co., Ltd.

Waseda University

Yoshimichi Ohki

Kenji Okamoto

Yuichi Hirose

Genta Wada

Toshikatsu Tanaka

A highly thermally conductive printed circuit board prevents electrochemical migration by inhibiting elution of copper ions. The printed circuit board is a metal-base printed circuit board including a metal base plate having an insulating resin layer and a copper foil layer stacked thereon in this order. In the printed circuit board, the insulating resin layer contains a first inorganic filler made of inorganic particles having particle diameters of 0.1 nm to 600 nm with an average particle diameter (D) of 1 nm to 300 nm, and a second inorganic filler made of inorganic particles having particle diameters of 100 nm to 100 &#x3bc;m with an average particle diameter (D) of 500 nm to 20 &#x3bc;m, and the first inorganic filler and the second inorganic filler are uniformly dispersed in the insulating resin layer.

Growing community of inventors

Tokyo, Japan

Yoshimichi Ohki