Hiratsuka, Japan

Yoshimasa Hirose

This inventor holds 1 USPTO granted patent. Top assignee: Electroplating Engineers of Japan Limited. Active years: 2004.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Yoshimasa Hirose. Retrieved from https://idiyas.com/inventor/yoshimasa-hirose

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 2.0

ph-index = 1

Forward Citations = 3(Granted Patents)


Company Filing History:


Years Active: 2004

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1 patent (USPTO):Explore Patents

Title: Innovations of Yoshimasa Hirose in Displacement Gold Plating Solutions.

Introduction

Yoshimasa Hirose is a notable inventor based in Hiratsuka, Japan. He has made significant contributions to the field of electroplating, particularly with his innovative approach to gold plating solutions. His work focuses on enhancing the adhesion properties and solderability of plated substrates.

Latest Patents

Hirose holds a patent for a non-cyanide displacement gold plating solution. This invention allows for effective displacement gold plating on electroless nickel-boron plated or electrolytic nickel plated substrates. The solution comprises specific concentrations of sodium gold sulfite, sulfite, organic carboxylic acid, and ethylene diamine tetraacetic acid, maintaining a pH value in the weak acid range of 4.5 to 6. This formulation ensures good adhesion properties and high solderability.

Career Highlights

Yoshimasa Hirose is associated with Electroplating Engineers of Japan Limited, where he applies his expertise in electroplating technologies. His innovative solutions have contributed to advancements in the industry, particularly in the development of environmentally friendly plating processes.

Collaborations

Hirose collaborates with fellow inventor Katsunori Hayashi, working together to enhance the effectiveness of electroplating solutions and processes.

Conclusion

Yoshimasa Hirose's contributions to the field of electroplating, particularly through his patented displacement gold plating solution, highlight his innovative spirit and commitment to advancing technology in this area. His work continues to influence the industry positively.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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