Gifu, Japan

Yoshihisa Maehata

This inventor holds 1 USPTO granted patent. Top assignee: Panasonic Corporation. Active years: 2010.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Yoshihisa Maehata. Retrieved from https://idiyas.com/inventor/yoshihisa-maehata

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


Average Co-Inventor Count = 5.0

ph-index = 1


Company Filing History:


Years Active: 2010

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1 patent (USPTO):Explore Patents

Title: Innovations by Yoshihisa Maehata

Introduction

Yoshihisa Maehata is a notable inventor based in Gifu, Japan. He has made significant contributions to the field of semiconductor technology. His innovative approach has led to advancements in module manufacturing processes.

Latest Patents

Yoshihisa Maehata holds a patent for a method of manufacturing a module. This module is formed of a semiconductor element that is flip-chip bonded to a substrate, along with a chip component soldered to the substrate. The patent describes a method that includes several steps: mounting the chip component and semiconductor element to the substrate, injecting resin into the gaps, and curing the module through heating. This method allows for a higher density of component mounting on the module, enhancing its efficiency.

Career Highlights

Yoshihisa Maehata is associated with Panasonic Corporation, where he has been instrumental in developing innovative technologies. His work has contributed to the advancement of semiconductor manufacturing techniques, making significant impacts in the industry.

Collaborations

Yoshihisa has collaborated with notable colleagues such as Junichi Kimura and Yoshitsugu Uenishi. Their teamwork has fostered an environment of innovation and creativity within their projects.

Conclusion

Yoshihisa Maehata's contributions to semiconductor technology through his patent and work at Panasonic Corporation highlight his role as a key innovator in the field. His methods for module manufacturing are paving the way for future advancements in technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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