Tsuchiura, Japan

Yoshihige Endou


Average Co-Inventor Count = 10.0

ph-index = 1

Forward Citations = 5(Granted Patents)


Company Filing History:


Years Active: 2003

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1 patent (USPTO):Explore Patents

Title: Innovations of Yoshihige Endou in Semiconductor Manufacturing

Introduction

Yoshihige Endou is a notable inventor based in Tsuchiura, Japan. He has made significant contributions to the field of semiconductor manufacturing, particularly through his innovative patent that enhances the accuracy of chip inspections.

Latest Patents

Yoshihige Endou holds a patent titled "Method for manufacturing substrate for inspecting semiconductor device." This invention utilizes a silicon substrate that includes a beam or diaphragm, a probe, and wiring. To ensure high precision in positioning the chip for inspection, a second substrate for alignment is placed on the primary substrate. The design incorporates projections or grooves formed in both substrates, which are essential for aligning the probe with the electrode pad of the chip. The preferred method for creating these features is silicon anisotropic etching, which results in a (111) crystal surface. Additionally, dry etching techniques, such as inductively coupled plasma-reactive ion etching (ICP-RIE), can be employed to achieve vertical columns or grooves with ease.

Career Highlights

Yoshihige Endou is associated with Hitachi, Ltd., a leading company in technology and innovation. His work at Hitachi has allowed him to focus on advancing semiconductor technologies, contributing to the company's reputation for excellence in the field.

Collaborations

Yoshihige has collaborated with esteemed colleagues, including Masatoshi Kanamaru and Atsushi Hosogane. Their combined expertise has fostered a productive environment for innovation and development in semiconductor manufacturing.

Conclusion

Yoshihige Endou's contributions to semiconductor manufacturing through his innovative patent demonstrate his commitment to advancing technology. His work not only enhances the accuracy of chip inspections but also reflects the collaborative spirit of innovation within the industry.

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